Surface smart phones and television production will, AMAT develop organic EL manufacturing apparatus

Applied Materials (AMAT) has developed so thin, lightweight, flexible mass production of flexible organic EL display manufacturing apparatus becomes possible. That the formation of a plasma CVD apparatus is protected from oxygen and moisture organic EL erosion of packaging films and so on. The general use of hard and thick glass packages through the glass into the film, the production can be soft, flexible organic EL display.

The launch of the two AMAT film forming apparatus. One based on smart phones and other mobile terminal with an organic EL display as an object of “Applied AKT-20K”. Corresponding to the size of the substrate is 925mm × 1500mm. Another is the large-screen TV with an organic EL display as an object of “Applied AKT-40K”. Corresponding to the size of the substrate is 1250mm × 2200mm.

To suppress organic EL deterioration in the manufacturing process, the apparatus can be formed on a low temperature below 100 ℃ package film. Moreover, even without the need for expensive photographic process using exposure and etching apparatus can also be formed with high positional accuracy package film. Allegedly, this is the use of self-developed image processing technology to improve positioning accuracy and precision deposition mask to achieve. Thus, when compared with the use of photographic technology, can significantly reduce manufacturing costs.

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Google will deliver a speech at the ISSCC 2016 on the human implantable devices

 

Google the relevant international conferences semiconductor integrated circuit technology “ISSCC (International Solid State Circuits Conference) 2016″ (January 31, 2016 – February 4 held in San Francisco) in the upper body on circuit design techniques used in implantable devices give a speech. In about image sensors, MEMS and medical technology sub-theme “IMMD” the tutorial session, Google’s Peng Cong will be entitled “Circuit Design Considerations for Implantable Devices” speech.

In addition, the meeting will be released on a number of areas of concern of health care outcomes. Intel will use nano-spaced DNA sequencing (analysis) technology speech (lecture number 16.1). KAIST will publish the information can be used to monitor the body tags semiconductor chip technology (lecture number 22.3).

ISSCC 2016 will be held in the history of the first keynote guest speakers outside, its theme is also medical health. Stanford University will BMI (brain-machine interface) released by human implantable circuit technical presentations (lecture number 22.1). This is a BMI in medical and other fields “has entered the pre-clinical stage, about to reach a practical level” (ISSCC 2016 Far East Committee) Hot technology.

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“flexible thermometer” Like a Band-Aid achieved by printing process

Soft curved, can be attached on the skin like a Band-Aid …… Japan Graduate School of Engineering, University of Tokyo research Cote appointed assistant Yokota know it and Professor Takao Someya’s team developed can use the print manufacturing process “flexible thermometer.” This printing process used to create a thin flexible plastic thermometer, attached to the body surface, successfully measured the surface temperature distribution. The product is used to monitor a baby conceived temperature such as health, medical and nursing care and other fields.

The development of flexible thermometer is the use of a printing process on a film substrate made. Thickness of only about 15μm, soft and flexible. Sensitivity up to 0.02 ℃, the response speed of up to 100ms. Experiments confirmed that even though repeated measurements close to 2,000 times, it will not lose reproducibility.

Not integrated power sensor circuit and reading circuit, but if you use R & D team previously developed technology, integrated power circuit and reading circuit principle. In the future, the research team will further reduce the thickness, increase the number of measurements can be repeated, towards commercialization of three years.

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Foley surplus Electronics Co., Ltd. using systems Orbotech produces high-quality flexible circuit boards

Orbotech Ltd. today announced that industry-leading soft board (FPC) Manufacturer Foley surplus Electronics Co., Ltd. (hereinafter referred to as “Fauré surplus”) once again select Orbotech production solutions for high-end thin flexible board production .

Foley surplus in Suzhou printed circuit board factory needed a superior solution to meet the requirements to obtain a high output and maximum yield while ensuring the best possible environmental benefits.
Foley surplus ultimately chose Paragon-Xpress 9 Laser Direct Imaging Orbotech (LDI) systems. The design of the system is designed to achieve up to 5,000 times a day, high-speed imaging capacity. The ability to achieve a high depth of field and significantly improve yields, the market today is known as one of the nine most stable solution Paragon-Xpress.
“We will Orbotech LDI system is mainly used for thin FPC production, in order to better serve our customers, and we also wanted a solution that can minimize the impact of production on the environment. Hope and Austria Symbol Technologies to establish long-term cooperative relationship can help us to continue to consolidate its leading position in the global soft board industry. “Mr. Xu Zhong Ying, general manager of Fleishman-Hillard.
Foley surplus was founded in 2010, we are committed to providing customers with high-quality soft circuit boards. The company in 2014 in the third quarter for the first time the acquisition of Orbotech products, the select Orbotech’s products again. Gaby Waisman Orbotech president of Asia Pacific, said: “We are very honored to be able to select Foley surplus Orbotech’s Paragon-Xpress laser direct imaging system for its latest flexible board production, our industry-proven system, dedicated to helping customers to improve yields, reduce costs and improve overall product quality. ”

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