Category Archives: Uncategorized

SMK launched capacitive touch screen surface for automotive

 

Japanese SMK company announced the development of an electrostatic capacity type touch-screen surface “CapSleek Touch” March 8, 2016, has begun to accept orders. The new products are the upper and lower two thin film electrode film / film (F1F) type, support surface cover. By using the transparent conductive sensor (ITO) film, it can be together in a vacuum environment to prevent the generation of bubbles, and the injection molding resin surface cover panel. Cover using a transfer molding technology, high degree of freedom in-mold decoration. The radius of curvature of the cover (R) 700, the curvature of the other products can also be customized.

Transmission rate of up to 88% (when affixed with optical film), the minimum reflectance of 9% (affixed with an optical thin film). Support handwriting input, the workload is 0N. Operating temperature range is -30 ℃ ~ + 85 ℃, storage temperature range of -40 ℃ ~ + 95 ℃. Contemplated for use in car navigation systems, car console, home appliances, commercial equipment.

In the capacitance-type touch screen aspect, SMK has introduced G2 is composed of a glass composed, OGS (One Glass Solution), the two glass glass / glass (G1G), F1F several products from the two thin film of the series . This time, the company hopes to launch the product surface, the expansion of product lines. Philippines factory plans to produce 100,000 units (converted by 7 inches) capacity for production.

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Molex offers Brad modular power solutions for molding the trunk cable

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Molex Incorporated offers a complete Brad modular power solutions product line for machine builders, which is characterized by having a maximum 30A, 600V AC / DC feeder line of sturdy molded trunk cable, as well as for the maximum 15A, 600V AC / DC branch distribution circuit tap-molded cable. Molex’s Brad power components are designed according to NFPA-79 industrial electrical equipment standard which meet UL2237 (PVVA) standard, can be used for motor branch circuits.
Ted Kyriazes, Molex global product manager, explains:. “Brad comply with UL2237 standard quick connect pressure module contains pre-wired and factory wiring harness connector molded, is an alternative to hard-wired machine ideal for these modules can create powerful, scalable and easy to install distribution system, eliminating the need for conventional pipe installation and special tools and skilled workers are usually required. ”

Brad power solutions for a variety of industries, including food and beverage processing, packaging and material handling, automotive assembly and pharmaceuticals. Brad wiring system provides a significant advantage over the operation of the pipeline based on hard-wired:

● reduce operating costs

● Faster machine assembly

● faster debugging new industrial equipment

Brad keyed power connector provides two choices for mechanically distinguishing trunk and feeder circuits, improve design flexibility. Tee (tee) with a flat head connector provides branch circuit to the access point field device, and the three-way connector with the trunk of the separation of the main feeder into the branch circuit portion. Brad key element is to establish three-way power modular scalable trunk and tap wires topology, providing an access point as a branch or a tap.

Brad quick-connect wiring harness connector and supports fast field wiring. All connectors have an extended ground wire pin characteristics, to meet the first mating / off eventually need. Brad harness using TC-ER cables (Tray-Rated, Exposed Run) manufacturing.

Kyriazes added: “Brad has a modular assembly system consistent and easy to copy, can provide advantages for situations involving multiple machines integrated Brad power to ensure product is fully compatible with industry-standard applications, providing Brad brand has been recognized by the industry. the unparalleled performance. ”

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Murata developed out of the bus with a multilayer ceramic capacitor

Murata has developed a maximum temperature of 200 ℃, and support the use of a conductive adhesive bonding of multilayer ceramic capacitor installation “GCB series.” Samples are currently available, pre-2016 production year. Mainly for in part with a severe temperature environment surrounding the car engine compartment, etc., such as control transmissions and other electronic control unit (ECU).

Development of products through the use of external electrodes “Ni / Pd electrode”, in a high temperature environment can be achieved with high bonding reliability conductive adhesive. In addition, compared with the original GCG products, new products to improve the corrosion resistance of the terminal electrodes.

Temperature characteristics there are two main series GCB. A is at -55 ~ + 150 ℃ electrostatic capacity change rate of ± 15% of the “X8R Characteristics”, the other is a change in electrostatic capacity at -55 ~ + 200 ℃ rate of + 15 / -50% for ” X9M characteristics. ” Rated voltage of 10 ~ 100Vdc. An electrostatic capacity of 1000pF ~ 0.47μF. Automotive electronic components comply with the standard “AEC-Q200″. Dimensions have dimension 1005 (1.0mm × 0.5mm × 0.5mm) and 1608 size (1.6mm × 0.8mm × 0.8mm) two kinds.

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6-inch flexible AMOLED display technology integration module and PEDOT touch panel

In the PI (polyimide) film made 6-inch flexible touch panel PEDOT no need to use an etching process and marks “multipurpose flexible electronic substrate technology” (FlexUpTM). Flexible test, the change in resistance after the PEDOT electrode 10K flexing test fell by 1%.

Flexible Test

PEDOT electrode application flexibility on FlexUpTM PI film needs to be assessed by a bending test. Bending radius referred to herein, cycle time and curvature of 5 mm, respectively, 10,000 and 2 seconds / times.

6-inch flexible PEDOT touch panel is produced using a PEDOT mapping technology and “multi-purpose flexible electronic substrate technology” (FlexUpTM) combined. After the AMOLED display module technology integration, through hand-painted, 5:00 touch and zoom in / out function, performance of this product has been successfully demonstrated. Conducting a 10,000 weeks within a radius of 5 mm / Outbound bending test after each PEDOT electrode resistance change rate of less than 1%. Based on the above test results, transparent, highly conductive PEDOT polymer could be used in a flexible touch panel fields.

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General Motors recalls truth,engineer make mistake after another

Some recent reports about the cars appear defect and recall (recall) are really disturbing. Although these incidents are not unusual, but no matter how hard engineers are trying to improve this type of incident will not let disappear.

“This does not only happen in the General Motors (GM),” the honorary chairman of the Center for Automotive Research David Cole: “Everyone in the automotive industry are likely to face this problem in the coming months, you’ll see more. more this type of event. ”

GM announced earlier this year called repair 2.4 million cars because of ignition device problem and the news topic. It is not only for the recovery of a car were spent $ 1.3 billion in maintenance costs, but also by the United States National Highway Traffic Safety Administration (NHTSA) cut a fine of $ 35,000 million. Over the past two weeks, the auto giant has successively recall 2.7 million, 2.4 million and 21,8000 vehicles, is expected to lead to another $ 400 million pen called repair expenses.

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Cabling technology for 3D technology and 7nm successive release

International Interconnect Technology Conference / Materials for Advanced Metallization Conference (IITC / AMC) 2015 hold in May 2015 from 18 to 21 in Grenoble, France (CEA-Leti within MINATEC). The meeting for the second time after a lapse of four years, was held in Europe, IITC and MAM jointly. As in previous years, the number of participants more than 200 people, the atmosphere is very active in live discussions.

From the point of view the number of papers, including keynote speeches, including ordinary speech of 42 papers, poster papers is 60. From the field of view, Materials & Unit Processes most, the proportion was 23 percent, also released a lot for 14 ~ 7nm process miniaturization technology. Followed by 3D Integration & Packaging (21%) and Novel Systems & Emerging Technology (16%). From the agency point of view, 44% of universities, research institutions accounted for 29%, the rest of the industry. The MAM also uphold the principle of more panels than in previous years were released, and this is one of the characteristics of this meeting.

Prior to this meeting, also on May 18 held a symposium. Morning’s theme is “Flexible Electronics: Application and Materials Challenges”, the afternoon’s theme is “2D Materials: Challenges and Application”. These are the EU (European Union) to develop industry-academia joint future growth areas.

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OLED will accelerate the replacement for LCD technology

OLED (Organic Light Emitting Diode) is based on the organic thin film spontaneous light display technology, with ultra-thin, ultra-wide viewing angle, flexible rollable, high color gamut, fast response and many other advantages, was considered a new generation of display technology. Since 1987 Professor Deng Qingyun discovery of this new material, which set off the development of the global boom continues. Professor Deng Qingyun said at the forum, is currently in a variety of applications, OLED has the LCD can not match advantage, the next two to three years, OLED display technology is bound to become the core, and gradually replace the conventional liquid crystal display technology.

Up to now, the global TV industry has gone through several display technology revolution, from the earliest CRT to plasma (PDP), liquid crystal (LCD), every upgrade is very difficult, but will be spawned huge business opportunities and lead the TV market reshuffle . Compared with the conventional display technology, OLED is even more rapid development.

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IEDM2015 opening, beyond the deep learning of “brain-chip” concern

 

International Society for Technology-related semiconductor device “2015 IEEE International Electron Devices Meeting” (IEDM 2015) held recently in Washington, DC (December 7, 2015 – the 9th).

The main topics are: 1) storage technology, 2) instead of new material such as silicon, transistors, and IC 3) three-dimensional structure, 4) power semiconductors, 5) silicon photonics, 6) flexible devices, 7) display and a photosensitive element technology, 8) class brain computing (Brain-like Computing)…

Key topics and focus paper organizers listed below. Focus storage technology is the use of 20nm process technology to achieve miniaturization or less DRAM, improved three-dimensional (3D) NAND flash technology reliability, improved ReRAM (variable resistive memory) packaging technology. Samsung Electronics will deliver a speech 20nm process DRAM.

New materials to replace silicon in 7nm technology and miniaturization technology in the future, will be released a few examples of the use of Ge and GaAs transistors Trial replace silicon and other semiconductor materials. Belgium IMEC will published content is on 300mm diameter wafers trial of InGaAs FET GAA (Gate-All-Around) structure and access to the high intrinsic.

3) three-dimensional structure of transistors and IC terms, using TSV (TSV) technology is the key, it will be released without using the TSV 3DIC technology. Tsinghua University in Taiwan will release 3DIC technology without TSV chip manufactured by logic, SRAM and ReRAM configuration.

4) power semiconductors, Fujitsu and Tokyo Institute of Technology research team will present at 96GHz to achieve high operating frequency of up to 3W / mm current output density of InGaN / GaN-HEMT .

5) silicon photonics technology, a major issue facing long-term – the light source technology has made progress. Although Ge bulk indirect migration, low luminous efficiency, but the compound has become a direct migratory GeSn. French research institute CEA LETI and other research team on a silicon CMOS-compatible use infrared technology to produce a GeSn microdisk lasers. According to the research team introduced, at a wavelength of 2.5μm obtained with up to 221kW / cm2 of output power.

6) a flexible device context, CEA LETI and STMicroelectronics will introduce the use of “UTTB (Ultimate Thinning and Transfer-Bonding)” technology, the RF circuit formed on an SOI substrate is transferred to a variety of flexible circuit board technology (Paper 15.7).

7) monitors and sensor technology, not only can be used to accept RGB pixel visible light, but also with a good sensitivity shooting near-infrared light image element of concern. In particular, a need exists in the medical use. Olympus will introduce two kinds of laminated element made of a CMOS sensor technology.

8) The focus of the class brain computing is to become a variety of techniques now concern depth neural network (DNN) next-generation technologies. DNN now exist can not go online and real-time learning and learning requires a lot of data and other topics. As a workaround, through the use of spike signals and the use of nonvolatile memory, so that “neurons (brain cells)” or connection “synapses” state neuronal plasticity switch has developed elements of concern. 2014 summer release spike signals using brain-chip “TrueNorth” of IBM, the use of non-volatile memory technology – phase change memory (PCM) trial a more realistic neurons and other chips.

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Why Apple iPhone To use EL panel

In general, the advantages of the liquid crystal panel substitution with an organic EL panel comprising: (1) without backlight and the optical film can realize a thin, lightweight, low power; (2) the use of a resin substrate, is not easily broken; (3 ) a high degree of freedom of shape, easily bent; (4) can be folded, and the like.

(1) thin, lightweight, low power consumption, and depending on the display image, the LCD panel power consumption is more dominant. However, if, as the Samsung Galaxy, as based on the use of black background screen display design, (although there are additional conditions, but) the power consumption of the organic EL panel will be substantially reduced. In the night sky of the Milky Way Galaxy inspired concept is impressive. However, it is hard to imagine that Apple will mimic Samsung’s concept. Of course, if in the future find a very high luminous efficiency of organic EL material, the organic EL panel in power consumption also will take advantage.

With regard to (2), as compared with the liquid crystal panel, an organic EL display easier to use a resin substrate. From smartphones whole, although the touch panel surface protective layer or glass, but obvious benefit is the display section of the substrate is not broken.

About (3), the LCD screen while bending, the thickness of the liquid crystal layer becomes different from the optical path within the optical film will change, leading to image degradation. One typical use curved screen smart phone is able to display the front and side of the Samsung “Galaxy S6 edge”. However, Samsung is still hard to imagine that Apple will mimic the concept.

About (4), Samsung may pioneered foldable smartphone. In this case, iPhone will be other people’s footsteps. Imagine Apple will do so.

This point of view, it is only “thin, lightweight”, “display board will not be broken,” “possible to achieve low power consumption,” several of the. Although very important, but if you want a new iPhone charm, still a little lacking impact, there is this feeling more than I should be a man now.

In addition, the organic EL LCD screen is also not as good as places such as screen resolution. Aspect LCD screen with a resolution of more than 500ppi products already in mass production, prototype has been done 800ppi. The organic EL panel has not been implemented on the RGB three-color light-emitting materials such fine patterning. The current practice is to try to make the image degradation obvious change pixels, or ignore the power consumption, using a combination of color filters and the white organic EL manner, so as to be close to the resolution of the liquid crystal. But to solve the problem fundamentally, but also innovative technology.

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Chino exhibited fuel cell temperature Visualization System

 

Japan Chino company (CHINO) without using a platinum catalyst for solid oxide fuel cell (SOFC) developer, launched a cell surface allows visualization of temperature distribution system, and in the “2015 System Control Fair / Exhibition 2015 Tokyo Measurement “(December 2 to 4 days, Tokyo Big Sight International Exhibition Center) on the display.

The temperature distribution of the surface of the fuel cell is important, because the uneven distribution of temperature will affect the life and reliability of the fuel cell. Occur simultaneously on the surface of the unit will reduce the temperature of the chemical reaction and can raise the temperature of the power generation. Caused by a chemical reaction of hydrogen produces water, the temperature will drop, and with the current power generation causes the temperature to rise. This easily leads to uneven distribution of surface temperature unit. At a temperature of different parts will produce stress, it is possible to shorten unit life, reduce reliability.

Chino has developed a fuel cell can be caught in the middle of a heat-resistant sapphire glass, and then placed in the furnace of the clamping device, can be distributed from the furnace temperature was observed for external thermal imager.

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